View GS816136T_1245887.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

GS816118(T/D)/GS816132(D)/GS816136(T/D)
GS816118 100-Pin TQFP Pinout (Package T)
VDDQ VSS NC NC DQB DQB VSS VDDQ DQB DQB FT VDD NC VSS DQB DQB VDDQ VSS DQB DQB DQPB NC VSS VDDQ NC NC NC
NC NC NC
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 1 80 2 79 3 78 4 77 5 76 6 75 7 74 8 73 9 72 1M X 18 10 71 Top View 11 70 12 69 13 68 14 67 15 66 16 65 17 64 18 63 19 62 20 61 21 60 22 59 23 58 24 57 25 56 26 55 27 54 28 53 29 52 30 51 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
A A E1 A NC NC BB BA A17 VDD VSS CK GW BW G ADSC ADSP ADV A A
A NC NC VDDQ VSS NC DQPA DQA DQA VSS VDDQ DQA DQA VSS NC VDD ZZ DQA DQA VDDQ VSS DQA DQA NC NC VSS VDDQ NC NC NC
Rev: 2.13 11/2004
LBO A A A A
A1 A0 TMS TDI VSS VDD TDO TCK A A A A A A A 2/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
GS816136 100-Pin TQFP Pinout (Package T)
DQPC DQC DQC VDDQ VSS DQC DQC DQC DQC VSS VDDQ DQC DQC FT VDD NC VSS DQD DQD VDDQ VSS DQD3 DQD DQD DQD VSS VDDQ DQD DQD DQPD
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 1 80 2 79 3 78 4 77 5 76 6 75 7 74 8 73 9 72 512K x 36 10 71 Top View 11 70 12 69 13 68 14 67 15 66 16 65 17 64 18 63 19 62 20 61 21 60 22 59 23 58 24 57 25 56 26 55 27 54 28 53 29 52 30 51 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
A A E1 A BD BC BB BA A17 VDD VSS CK GW BW G ADSC ADSP ADV A A
DQPB DQB DQB VDDQ VSS DQB DQB DQB DQB VSS VDDQ DQB DQB VSS NC VDD ZZ DQA DQA VDDQ VSS DQA DQA DQA DQA VSS VDDQ DQA DQA DQPA
LBO A A A A A1 A0 TMS TDI VSS VDD Rev: 2.13 11/2004 3/36
TDO TCK A A A A A A A
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
TQFP Pin Description Symbol
A0, A1 A DQA DQB DQC DQD NC BW BA, BB, BC, BD CK GW E1 G ADV ADSP, ADSC ZZ TMS TDI TDO TCK FT LBO VDD VSS VDDQ
Type
I I I/O -- I I I I I I I I I I I O I I I I I I
Description
Address field LSBs and Address Counter preset Inputs Address Input Data Input and Output pins No Connect Byte Write--Writes all enabled bytes; active low Byte Write Enable for DQA, DQB Data I/Os; active low Clock Input Signal; active high Global Write Enable--Writes all bytes; active low Chip Enable; active low Output Enable; active low Burst address counter advance enable; active low Address Strobe (Processor, Cache Controller); active low Sleep Mode control; active high Scan Test Mode Select Scan Test Data In Scan Test Data Out Scan Test Clock Flow Through or Pipeline mode; active low Linear Burst Order mode; active low Core power supply I/O and Core Ground Output driver power supply
Rev: 2.13 11/2004
4/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
165 Bump BGA--x18 Commom I/O--Top View (Package D)
1 A B C D E F G H J K L M N P R NC NC NC NC NC NC NC FT DQB DQB DQB DQB DQPB NC LBO 2 A A NC DQB DQB DQB DQB MCL NC NC NC NC NC NC NC 3 E1 E2 VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A A 4 BB NC VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A 5 NC BA VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDI TMS 6 E3 CK VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC A1 A0 7 BW GW VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDO TCK 8 ADSC G VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A 9 ADV ADSP VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A A 10 A A NC NC NC NC NC NC DQA DQA DQA DQA NC A A 11 A18 NC DQPA DQA DQA DQA DQA ZZ NC NC NC NC NC A17 A A B C D E F G H J K L M N P R
11 x 15 Bump BGA--13mm x 15 mm Body--1.0 mm Bump Pitch
Rev: 2.13 11/2004
5/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
165 Bump BGA--x32 Common I/O--Top View (Package D)
1 A B C D E F G H J K L M N P R NC NC NC DQC DQC DQC DQC FT DQD DQD DQD DQD NC NC LBO 2 A A NC DQC DQC DQC DQC MCL DQD DQD DQD DQD NC NC NC 3 E1 E2 VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A A 4 BC BD VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A 5 BB BA VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDI TMS 6 E3 CK VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC A1 A0 7 BW GW VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDO TCK 8 ADSC G VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A 9 ADV ADSP VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A A 10 A A NC DQB DQB DQB DQB ZQ DQA DQA DQA DQA NC A A 11 NC NC NC DQB DQB DQB DQB ZZ DQA DQA DQA DQA NC A17 A A B C D E F G H J K L M N P R
11 x 15 Bump BGA--13mm x 15 mm Body--1.0 mm Bump Pitch
Rev: 2.13 11/2004
6/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
165 Bump BGA--x36 Common I/O--Top View (Package D)
1 A B C D E F G H J K L M N P R NC NC DQPC DQC DQC DQC DQC FT DQD DQD DQD DQD DQPD NC LBO 2 A A NC DQC DQC DQC DQC MCL DQD DQD DQD DQD NC NC NC 3 E1 E2 VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A A 4 BC BD VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A 5 BB BA VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDI TMS 6 E3 CK VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC A1 A0 7 BW GW VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDO TCK 8 ADSC G VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A 9 ADV ADSP VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A A 10 A A NC DQB DQB DQB DQB NC DQA DQA DQA DQA NC A A 11 NC NC DQPB DQB DQB DQB DQB ZZ DQA DQA DQA DQA DQPA A17 A A B C D E F G H J K L M N P R
11 x 15 Bump BGA--13mm x 15 mm Body--1.0 mm Bump Pitch
Rev: 2.13 11/2004
7/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
GS816118/32/36D 165-Bump BGA Pin Description Symbol
A0, A1 An DQA DQB DQC DQD BA, BB, BC, BD NC CK BW GW E1 E3 E2 G ADV ADSC, ADSP ZZ FT LBO TMS TDI TDO TCK MCL VDD VSS VDDQ
Type
I I I/O I -- I I I I I I I I I I I I I I O I -- I I I
Description
Address field LSBs and Address Counter Preset Inputs Address Inputs Data Input and Output pins Byte Write Enable for DQA, DQB, DQC, DQD I/Os; active low No Connect Clock Input Signal; active high Byte Write--Writes all enabled bytes; active low Global Write Enable--Writes all bytes; active low Chip Enable; active low Chip Enable; active low Chip Enable; active high Output Enable; active low Burst address counter advance enable; active l0w Address Strobe (Processor, Cache Controller); active low Sleep mode control; active high Flow Through or Pipeline mode; active low Linear Burst Order mode; active low Scan Test Mode Select Scan Test Data In Scan Test Data Out Scan Test Clock Must Connect Low Core power supply I/O and Core Ground Output driver power supply
Rev: 2.13 11/2004
8/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
GS816118(T/D)/GS816132(D)/GS816136(T/D) Block Diagram
Register
A0-An
D
Q A0 D0 A1 Q0 D1 Q1 Counter Load A0 A1
A
LBO ADV CK ADSC ADSP GW BW BA
Register
Memory Array
Q D Q 36 D 36
Register
D BB
Q 4 4
Register
D BC
Q
Register
D
Q
Register
D BD
Q
Register 4
Register
D
Q
36 36 36
E1
Register
D
Q
36 32 Parity Encode 4 Parity Compare 36
Register
D
Q
FT G Power Down Control
ZZ
1
DQx1-DQx9
NC
D NC
Note: Only x36 version shown for simplicity.
Rev: 2.13 11/2004
9/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Q
Q D
Register
GS816118(T/D)/GS816132(D)/GS816136(T/D)
Mode Pin Functions Mode Name
Burst Order Control Output Register Control Power Down Control
Pin Name
LBO FT ZZ
State
L H L H or NC L or NC H
Function
Linear Burst Interleaved Burst Flow Through Pipeline Active Standby, IDD = ISB
Note: There are pull-up devices on the ZQ and FT pins and a pull-down device on the ZZ pin, so those input pins can be unconnected and the chip will operate in the default states as specified in the above tables. Burst Counter Sequences
Linear Burst Sequence A[1:0] A[1:0] A[1:0] A[1:0]
1st address 2nd address 3rd address 4th address 00 01 10 11 01 10 11 00 10 11 00 01 11 00 01 10
Interleaved Burst Sequence A[1:0] A[1:0] A[1:0] A[1:0]
1st address 2nd address 3rd address 4th address 00 01 10 11 01 00 11 10 10 11 00 01 11 10 01 00
Note: The burst counter wraps to initial state on the 5th clock.
Note: The burst counter wraps to initial state on the 5th clock.
BPR 1999.05.18
Rev: 2.13 11/2004
10/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
Byte Write Truth Table Function
Read Read Write byte a Write byte b Write byte c Write byte d Write all bytes
GW
H H H H H H H
BW
H L L L L L L
BA
X H L H H H L
BB
X H H L H H L
BC
X H H H L H L
BD
X H H H H L L
Notes
1 1 2, 3 2, 3 2, 3, 4 2, 3, 4 2, 3, 4
Write all bytes L X X X X X Notes: 1. All byte outputs are active in read cycles regardless of the state of Byte Write Enable inputs. 2. Byte Write Enable inputs BA, BB, BC and/or BD may be used in any combination with BW to write single or multiple bytes. 3. All byte I/Os remain High-Z during all write operations regardless of the state of Byte Write Enable inputs. 4. Bytes "C" and "D" are only available on the x36 version.
Rev: 2.13 11/2004
11/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
Synchronous Truth Table Operation
Deselect Cycle, Power Down Read Cycle, Begin Burst Read Cycle, Begin Burst Write Cycle, Begin Burst Read Cycle, Continue Burst Read Cycle, Continue Burst Write Cycle, Continue Burst Write Cycle, Continue Burst Read Cycle, Suspend Burst Read Cycle, Suspend Burst Write Cycle, Suspend Burst
Address Used
None External External External Next Next Next Next Current Current Current
State Diagram Key5
X R R W CR CR CW CW
E1
H L L L X H X H X H X
ADSP
X L H H H X H X H X H
ADSC
L X L L H H H H H H H
ADV
X X X X L L L L H H H
W3
X X F T F F T T F F T
DQ4
High-Z Q Q D Q Q D D Q Q D
Write Cycle, Suspend Burst Current H X H H T D Notes: 1. X = Don't Care, H = High, L = Low 2. W = T (True) and F (False) is defined in the Byte Write Truth Table preceding. 3. G is an asynchronous input. G can be driven high at any time to disable active output drivers. G low can only enable active drivers (shown as "Q" in the Truth Table above). 4. All input combinations shown above are tested and supported. Input combinations shown in gray boxes need not be used to accomplish basic synchronous or synchronous burst operations and may be avoided for simplicity. 5. Tying ADSP high and ADSC low allows simple non-burst synchronous operations. See BOLD items above. 6. Tying ADSP high and ADV low while using ADSC to load new addresses allows simple burst operations. See ITALIC items above.
Rev: 2.13 11/2004
12/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
Simplified State Diagram
X
Deselect W W Simple Synchronous Operation R R
X CW
First Write
R CR
First Read
X CR
Simple Burst Synchronous Operation
W R X Burst Write CR CW
R
Burst Read
X
CR
Notes: 1. The diagram shows only supported (tested) synchronous state transitions. The diagram presumes G is tied low. 2. The upper portion of the diagram assumes active use of only the Enable (E1) and Write (BA, BB, BC, BD, BW, and GW) control inputs, and that ADSP is tied high and ADSC is tied low. 3. The upper and lower portions of the diagram together assume active use of only the Enable, Write, and ADSC control inputs, and assumes ADSP is tied high and ADV is tied low.
Rev: 2.13 11/2004
13/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
Simplified State Diagram with G
X
Deselect W W X W CW R R
First Write
R CR
First Read
X CR
CW
W X Burst Write R CR W CW
R X
Burst Read
CW
CR
Notes: 1. The diagram shows supported (tested) synchronous state transitions plus supported transitions that depend upon the use of G. 2. Use of "Dummy Reads" (Read Cycles with G High) may be used to make the transition from read cycles to write cycles without passing through a deselect cycle. Dummy read cycles increment the address counter just like normal read cycles. 3. Transitions shown in gray tone assume G has been pulsed high long enough to turn the RAM's drivers off and for incoming data to meet Data Input Set Up Time.
Rev: 2.13 11/2004
14/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
Absolute Maximum Ratings
(All voltages reference to VSS)
Symbol
VDD VDDQ VI/O VIN IIN IOUT PD TSTG TBIAS
Description
Voltage on VDD Pins Voltage in VDDQ Pins Voltage on I/O Pins Voltage on Other Input Pins Input Current on Any Pin Output Current on Any I/O Pin Package Power Dissipation Storage Temperature Temperature Under Bias
Value
-0.5 to 4.6 -0.5 to 4.6 -0.5 to VDDQ +0.5 ( 4.6 V max.) -0.5 to VDD +0.5 ( 4.6 V max.) +/-20 +/-20 1.5 -55 to 125 -55 to 125
Unit
V V V V mA mA W
o o
C C
Note: Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended Operating Conditions. Exposure to conditions exceeding the Absolute Maximum Ratings, for an extended period of time, may affect reliability of this component.
Power Supply Voltage Ranges Parameter
3.3 V Supply Voltage 2.5 V Supply Voltage 3.3 V VDDQ I/O Supply Voltage 2.5 V VDDQ I/O Supply Voltage
Symbol
VDD3 VDD2 VDDQ3 VDDQ2
Min.
3.0 2.3 3.0 2.3
Typ.
3.3 2.5 3.3 2.5
Max.
3.6 2.7 3.6 2.7
Unit
V V V V
Notes
Notes: 1. The part numbers of Industrial Temperature Range versions end the character "I". Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be -2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
Rev: 2.13 11/2004
15/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
VDDQ3 Range Logic Levels Parameter
VDD Input High Voltage VDD Input Low Voltage VDDQ I/O Input High Voltage VDDQ I/O Input Low Voltage
Symbol
VIH VIL VIHQ VILQ
Min.
2.0 -0.3 2.0 -0.3
Typ.
-- -- -- --
Max.
VDD + 0.3 0.8 VDDQ + 0.3 0.8
Unit
V V V V
Notes
1 1 1,3 1,3
Notes: 1. The part numbers of Industrial Temperature Range versions end the character "I". Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be -2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC. 3. VIHQ (max) is voltage on VDDQ pins plus 0.3 V.
VDDQ2 Range Logic Levels Parameter
VDD Input High Voltage VDD Input Low Voltage VDDQ I/O Input High Voltage VDDQ I/O Input Low Voltage
Symbol
VIH VIL VIHQ VILQ
Min.
0.6*VDD -0.3 0.6*VDD -0.3
Typ.
-- -- -- --
Max.
VDD + 0.3 0.3*VDD VDDQ + 0.3 0.3*VDD
Unit
V V V V
Notes
1 1 1,3 1,3
Notes: 1. The part numbers of Industrial Temperature Range versions end the character "I". Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be -2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC. 3. VIHQ (max) is voltage on VDDQ pins plus 0.3 V.
Recommended Operating Temperatures Parameter
Ambient Temperature (Commercial Range Versions) Ambient Temperature (Industrial Range Versions)
Symbol
TA TA
Min.
0 -40
Typ.
25 25
Max.
70 85
Unit
C C
Notes
2 2
Notes: 1. The part numbers of Industrial Temperature Range versions end the character "I". Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be -2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
Rev: 2.13 11/2004
16/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
Undershoot Measurement and Timing
VIH VDD + 2.0 V VSS 50% VSS - 2.0 V 50% tKC VIL 50% VDD
Overshoot Measurement and Timing
50% tKC
Capacitance
(TA = 25oC, f = 1 MHZ, VDD = 2.5 V)
Parameter
Input Capacitance Input/Output Capacitance Note: These parameters are sample tested.
Symbol
CIN CI/O
Test conditions
VIN = 0 V VOUT = 0 V
Typ.
4 6
Max.
5 7
Unit
pF pF
AC Test Conditions Parameter
Input high level Input low level Input slew rate Input reference level Output reference level Output load
Conditions
VDD - 0.2 V 0.2 V 1 V/ns VDD/2 VDDQ/2 Fig. 1
Notes: 1. Include scope and jig capacitance. 2. Test conditions as specified with output loading as shown in Fig. 1 unless otherwise noted. 3. Device is deselected as defined by the Truth Table.
Output Load 1 DQ 50 VDDQ/2
* Distributed Test Jig Capacitance
30pF*
Rev: 2.13 11/2004
17/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
DC Electrical Characteristics Parameter
Input Leakage Current (except mode pins) ZZ Input Current FT Input Current Output Leakage Current Output High Voltage Output High Voltage Output Low Voltage
Symbol
IIL IIN1 IIN2 IOL VOH2 VOH3 VOL
Test Conditions
VIN = 0 to VDD VDD VIN VIH 0 V VIN VIH VDD VIN VIL 0 V VIN VIL Output Disable, VOUT = 0 to VDD IOH = -8 mA, VDDQ = 2.375 V IOH = -8 mA, VDDQ = 3.135 V IOL = 8 mA
Min
-1 uA -1 uA -1 uA -100 uA -1 uA -1 uA 1.7 V 2.4 V --
Max
1 uA 1 uA 100 uA 1 uA 1 uA 1 uA -- -- 0.4 V
Rev: 2.13 11/2004
18/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Operating Currents
-250 Mode IDD IDDQ IDD IDDQ IDD IDDQ IDD IDDQ IDD IDDQ IDD IDDQ 180 20 260 15 165 10 20 20 85 60 90 65 30 20 80 60 30 20 30 30 85 65 175 10 155 10 165 10 150 10 20 20 75 50 270 15 235 15 245 15 215 15 225 15 160 10 30 30 80 55 190 20 170 20 180 20 165 15 175 15 IDD IDDQ IDD IDDQ ISB ISB IDD IDD 290 30 155 15 185 10 140 10 20 20 64 50 300 30 265 30 275 30 240 25 250 25 205 20 215 20 165 15 195 10 150 10 30 30 70 55 165 10 175 10 155 10 165 10 150 10 160 10 140 10 150 10 135 10 190 20 150 15 170 10 135 10 20 20 60 50 260 20 270 20 235 20 245 20 215 15 225 15 185 15 195 15 170 15 180 15 145 10 200 20 160 15 180 10 145 10 30 30 65 55 180 20 190 20 170 20 180 20 165 15 175 15 155 15 165 15 150 15 160 15 140 10 155 10 125 10 170 15 140 10 155 10 125 10 20 20 50 45 290 40 300 40 265 35 275 35 240 30 250 30 205 25 215 25 190 25 200 25 170 20 Symbol 0 to 70C -40 to 85C Unit 180 20 150 10 165 10 135 10 180 15 150 10 165 10 135 10 30 30 55 50
mA mA mA mA mA mA mA mA mA mA mA mA
-225 0 to 70C -40 to 85C -40 to 85C -40 to 85C -40 to 85C -40 to 85C 0 to 70C 0 to 70C 0 to 70C 0 to 70C
-200
-166
-150
-133
Rev: 2.13 11/2004 Pipeline (x36) Flow Through Pipeline (x18) Flow Through Pipeline (x36) Flow Through Pipeline (x18) Flow Through Pipeline -- Flow Through Pipeline -- Flow Through
Parameter
Test Conditions
Operating Current
3.3 V
Device Selected; All other inputs VIH or VIL Output open
19/36
Operating Current
2.5 V
Device Selected; All other inputs VIH or VIL Output open
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Standby Current
ZZ VDD - 0.2 V
Deselect Current
Device Deselected; All other inputs VIH or VIL
GS816118(T/D)/GS816132(D)/GS816136(T/D)
(c) 1999, GSI Technology
Notes: 1. IDD and IDDQ apply to any combination of VDD3, VDD2, VDDQ3, and VDDQ2 operation. 2. All parameters listed are worst case scenario.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
AC Electrical Characteristics
Parameter Clock Cycle Time Clock to Output Valid Pipeline Clock to Output Invalid Clock to Output in Low-Z Setup time Hold time Clock Cycle Time Clock to Output Valid Flow Through Clock to Output Invalid Clock to Output in Low-Z Setup time Hold time Clock HIGH Time Clock LOW Time Clock to Output in High-Z G to Output Valid G to output in Low-Z G to output in High-Z ZZ setup time ZZ hold time ZZ recovery Symbol tKC tKQ tKQX tLZ tS tH tKC tKQ tKQX tLZ1 tS tH tKH tKL tHZ1 tOE tOLZ1 tOHZ1 tZZS2 tZZH2 tZZR
1
-250 Min 4.0 -- 1.5 1.5 1.2 0.2 5.5 -- 3.0 3.0 1.5 0.5 1.3 1.5 1.5 -- 0 -- 5 1 20 Max -- 2.5 -- -- -- -- -- 5.5 -- -- -- -- -- -- 2.3 2.3 -- 2.3 -- -- --
-225 Min 4.4 -- 1.5 1.5 1.3 0.3 6.0 -- 3.0 3.0 1.5 0.5 1.3 1.5 1.5 -- 0 -- 5 1 20 Max -- 2.7 -- -- -- -- -- 6.0 -- -- -- -- -- -- 2.5 2.5 -- 2.5 -- -- --
-200 Min 5.0 -- 1.5 1.5 1.4 0.4 6.5 -- 3.0 3.0 1.5 0.5 1.3 1.5 1.5 -- 0 -- 5 1 20 Max -- 3.0 -- -- -- -- -- 6.5 -- -- -- -- -- -- 3.0 3.2 -- 3.0 -- -- --
-166 Min 6.0 -- 1.5 1.5 1.5 0.5 7.0 -- 3.0 3.0 1.5 0.5 1.3 1.5 1.5 -- 0 -- 5 1 20 Max -- 3.4 -- -- -- -- -- 7.0 -- -- -- -- -- -- 3.0 3.5 -- 3.0 -- -- --
-150 Min 6.7 -- 1.5 1.5 1.5 0.5 7.5 -- 3.0 3.0 1.5 0.5 1.5 1.7 1.5 -- 0 -- 5 1 20 Max -- 3.8 -- -- -- -- -- 7.5 -- -- -- -- -- -- 3.0 3.8 -- 3.0 -- -- --
-133 Min 7.5 -- 1.5 1.5 1.5 0.5 8.5 -- 3.0 3.0 1.5 0.5 1.7 2 1.5 -- 0 -- 5 1 20 Max -- 4.0 -- -- -- -- -- 8.5 -- -- -- -- -- -- 3.0 4.0 -- 3.0 -- -- --
Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Notes: 1. These parameters are sampled and are not 100% tested 2. ZZ is an asynchronous signal. However, In order to be recognized on any given clock cycle, ZZ must meet the specified setup and hold times as specified above.
Rev: 2.13 11/2004
20/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
Pipeline Mode Timing
Begin
Read A
Cont
Cont
Deselect Write B Single Write tKL tKH tKC
Read C
Read C+1 Read C+2 Read C+3 Cont Burst Read
Deselect
Single Read
CK ADSP tS tH ADSC tS ADV tS tH A0-An
A B C ADSC initiated read
tH
tS GW tS BW tH tS Ba-Bd tS tH E1 tS tH E2 tS tH E3 G tS tOE DQa-DQd tOHZ
Q(A) D(B) E2 and E3 only sampled with ADSP and ADSC E1 masks ADSP Deselected with E1
tH
tKQ tH tLZ
Q(C) Q(C+1) Q(C+2)
tKQX tHZ
Q(C+3)
Rev: 2.13 11/2004
21/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
Flow Through Mode Timing
Begin
Read A
Cont tKL tKH
Cont tKC
Write B
Read C
Read C+1 Read C+2 Read C+3 Read C
Cont
Deselect
CK ADSP tS tH ADSC tS tH ADV tS tH A0-An
A B C Fixed High
tS tH ADSC initiated read
tS tH GW tS tH BW tS tH Ba-Bd tS tH E1 tS tH E2 tS tH E3 G tH tS tOE DQa-DQd
Q(A) Deselected with E1
E2 and E3 only sampled with ADSC
tOHZ
D(B)
tKQ tLZ
Q(C) Q(C+1) Q(C+2) Q(C+3) Q(C)
tHZ tKQX
Rev: 2.13 11/2004
22/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
Sleep Mode
During normal operation, ZZ must be pulled low, either by the user or by its internal pull down resistor. When ZZ is pulled high, the SRAM will enter a Power Sleep mode after 2 cycles. At this time, internal state of the SRAM is preserved. When ZZ returns to low, the SRAM operates normally after ZZ recovery time. Sleep mode is a low current, power-down mode in which the device is deselected and current is reduced to ISB2. The duration of Sleep mode is dictated by the length of time the ZZ is in a High state. After entering Sleep mode, all inputs except ZZ become disabled and all outputs go to High-Z The ZZ pin is an asynchronous, active high input that causes the device to enter Sleep mode. When the ZZ pin is driven high, ISB2 is guaranteed after the time tZZI is met. Because ZZ is an asynchronous input, pending operations or operations in progress may not be properly completed if ZZ is asserted. Therefore, Sleep mode must not be initiated until valid pending operations are completed. Similarly, when exiting Sleep mode during tZZR, only a Deselect or Read commands may be applied while the SRAM is recovering from Sleep mode.
Sleep Mode Timing Diagram
tKH tKC CK Setup Hold ADSP ADSC tZZR tZZS ZZ tZZH tKL
Application Tips
Single and Dual Cycle Deselect SCD devices (like this one) force the use of "dummy read cycles" (read cycles that are launched normally but that are ended with the output drivers inactive) in a fully synchronous environment. Dummy read cycles waste performance but their use usually assures there will be no bus contention in transitions from reads to writes or between banks of RAMs. DCD SRAMs do not waste bandwidth on dummy cycles and are logically simpler to manage in a multiple bank application (wait states need not be inserted at bank address boundary crossings) but greater care must be exercised to avoid excessive bus contention.
JTAG Port Operation
Overview The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with VDD. The JTAG output drivers are powered by VDDQ. Disabling the JTAG Port It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG Port unused, TCK, TDI, and TMS may be left floating or tied to either VDD or VSS. TDO should be left unconnected.
Rev: 2.13 11/2004
23/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
JTAG Pin Descriptions Pin
TCK TMS
Pin Name
Test Clock Test Mode Select
I/O
In In
Description
Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate from the falling edge of TCK. The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP controller state machine. An undriven TMS input will produce the same result as a logic one input level. The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers placed between TDI and TDO. The register placed between TDI and TDO is determined by the state of the TAP Controller state machine and the instruction that is currently loaded in the TAP Instruction Register (refer to the TAP Controller State Diagram). An undriven TDI pin will produce the same result as a logic one input level.
TDI
Test Data In
In
TDO
Test Data Out
Output that is active depending on the state of the TAP state machine. Output changes in Out response to the falling edge of TCK. This is the output side of the serial registers placed between TDI and TDO.
Note: This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up.
JTAG Port Registers
Overview The various JTAG registers, refered to as Test Access Port orTAP Registers, are selected (one at a time) via the sequences of 1s and 0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the rising edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the TDI and TDO pins. Instruction Register The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the controller is placed in Test-Logic-Reset state. Bypass Register The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through the RAM's JTAG Port to another device in the scan chain with as little delay as possible. Boundary Scan Register The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM's input or I/O pins. The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port's TDO pin. The Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z, SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register.
Rev: 2.13 11/2004
24/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
JTAG TAP Block Diagram
* * *
108
*
*
*
*
*
*
* *
1
Boundary Scan Register
0
Bypass Register
210
0
Instruction Register TDI ID Code Register
31 30 29
TDO
*
***
210
Control Signals TMS TCK Test Access Port (TAP) Controller
Identification (ID) Register The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM. It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins.
ID Register Contents
Die Revision Code Bit # x36 x18 GSI Technology JEDEC Vendor ID Code Presence Register 0 1 1
Not Used
I/O Configuration
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 X X X X X X X X 0 0 0 0 0 0 X X 1 1 0 0 0 0 1 1 0 0 0 0 0 0 0 0 1 1 0 0 0 1 0 0 0 0 0 011011001 0 011011001
Rev: 2.13 11/2004
25/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
Tap Controller Instruction Set
Overview There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific (Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load address, data or control signals into the RAM or to preload the I/O buffers. When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01. When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this device is listed in the following table.
JTAG Tap Controller State Diagram
1
Test Logic Reset
0 1 1 1
0
Run Test Idle
Select DR
0 1
Select IR
0 1
Capture DR
0
Capture IR
0
Shift DR
1 1
0 1
Shift IR
1
0
Exit1 DR
0
Exit1 IR
0
Pause DR
1
0
Pause IR
1
0
Exit2 DR
1
0
Exit2 IR
1
0
Update DR
1 0
Update IR
1 0
Instruction Descriptions BYPASS When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This occurs when the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facilitate testing of other devices in the scan path.
Rev: 2.13 11/2004
26/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
SAMPLE/PRELOAD SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is loaded in the Instruction Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and I/O buffers into the Boundary Scan Register. Boundary Scan Register locations are not associated with an input or I/O pin, and are loaded with the default state identified in the Boundary Scan Chain table at the end of this section of the datasheet. Because the RAM clock is independent from the TAP Clock (TCK) it is possible for the TAP to attempt to capture the I/O ring contents while the input buffers are in transition (i.e. in a metastable state). Although allowing the TAP to sample metastable inputs will not harm the device, repeatable results cannot be expected. RAM input signals must be stabilized for long enough to meet the TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-DR state then places the boundary scan register between the TDI and TDO pins. EXTEST EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with all logic 0s. The EXTEST command does not block or override the RAM's input pins; therefore, the RAM's internal state is still determined by its input pins. Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command. Then the EXTEST command is used to output the Boundary Scan Register's contents, in parallel, on the RAM's data output drivers on the falling edge of TCK when the controller is in the Update-IR state. Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruction is selected, the sate of all the RAM's input and I/O pins, as well as the default values at Scan Register locations not associated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR state, the RAM's output pins drive out the value of the Boundary Scan Register location with which each output pin is associated. IDCODE The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction loaded in at power up and any time the controller is placed in the Test-Logic-Reset state. SAMPLE-Z If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (highZ) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR state. RFU These instructions are Reserved for Future Use. In this device they replicate the BYPASS instruction.
Rev: 2.13 11/2004
27/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
JTAG TAP Instruction Set Summary Instruction
EXTEST IDCODE SAMPLE-Z RFU SAMPLE/ PRELOAD GSI RFU
Code
000 001 010 011 100 101 110
Description
Places the Boundary Scan Register between TDI and TDO. Preloads ID Register and places it between TDI and TDO. Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO. Forces all RAM output drivers to High-Z. Do not use this instruction; Reserved for Future Use. Replicates BYPASS instruction. Places Bypass Register between TDI and TDO. Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO. GSI private instruction. Do not use this instruction; Reserved for Future Use. Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
Notes
1 1, 2 1 1 1 1 1 1
BYPASS 111 Places Bypass Register between TDI and TDO. Notes: 1. Instruction codes expressed in binary, MSB on left, LSB on right. 2. Default instruction automatically loaded at power-up and in test-logic-reset state.
Rev: 2.13 11/2004
28/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
JTAG Port Recommended Operating Conditions and DC Characteristics Parameter
3.3 V Test Port Input High Voltage 3.3 V Test Port Input Low Voltage 2.5 V Test Port Input High Voltage 2.5 V Test Port Input Low Voltage TMS, TCK and TDI Input Leakage Current TMS, TCK and TDI Input Leakage Current TDO Output Leakage Current Test Port Output High Voltage Test Port Output Low Voltage Test Port Output CMOS High Test Port Output CMOS Low
Symbol
VIHJ3 VILJ3 VIHJ2 VILJ2 IINHJ IINLJ IOLJ VOHJ VOLJ VOHJC VOLJC
Min.
2.0 -0.3 0.6 * VDD2 -0.3 -300 -1 -1 1.7 -- VDDQ - 100 mV --
Max.
VDD3 +0.3 0.8 VDD2 +0.3 0.3 * VDD2 1 100 1 -- 0.4 -- 100 mV
Unit Notes
V V V V uA uA uA V V V V 1 1 1 1 2 3 4 5, 6 5, 7 5, 8 5, 9
Notes: 1. Input Under/overshoot voltage must be -2 V > Vi < VDDn +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tTKC. 2. VILJ VIN VDDn 3. 0 V VIN VILJn 4. Output Disable, VOUT = 0 to VDDn 5. The TDO output driver is served by the VDDQ supply. 6. IOHJ = -4 mA 7. IOLJ = + 4 mA 8. IOHJC = -100 uA 9. IOHJC = +100 uA
JTAG Port AC Test Conditions Parameter
Input high level Input low level Input slew rate Input reference level Output reference level
Conditions
VDD - 0.2 V 0.2 V 1 V/ns VDDQ/2 VDDQ/2 DQ
JTAG Port AC Test Load
50 VDDQ/2
* Distributed Test Jig Capacitance
30pF*
Notes: 1. Include scope and jig capacitance. 2. Test conditions as shown unless otherwise noted.
Rev: 2.13 11/2004
29/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
JTAG Port Timing Diagram
tTKC TCK tTH tTS TDI tTH tTS TMS tTKQ TDO tTH tTS Parallel SRAM input
tTKH
tTKL
JTAG Port AC Electrical Characteristics
Parameter TCK Cycle Time TCK Low to TDO Valid TCK High Pulse Width TCK Low Pulse Width TDI & TMS Set Up Time TDI & TMS Hold Time Symbol tTKC tTKQ tTKH tTKL tTS tTH Min 50 -- 20 20 10 10 Max -- 20 -- -- -- -- Unit ns ns ns ns ns ns
Boundary Scan (BSDL Files) For information regarding the Boundary Scan Chain, or to obtain BSDL files for this part, please contact our Applications Engineering Department at: apps@gsitechnology.com.
Rev: 2.13 11/2004
30/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
TQFP Package Drawing (Package T) L Symbol
A1 A2 b c D D1 E E1 e L L1 Y
c Pin 1
Description
Standoff Body Thickness Lead Width Lead Thickness Terminal Dimension Package Body Terminal Dimension Package Body Lead Pitch Foot Length Lead Length Coplanarity Lead Angle
Min. Nom. Max
0.05 1.35 0.20 0.09 21.9 19.9 15.9 13.9 -- 0.45 -- 0.10 1.40 0.30 -- 22.0 20.0 16.0 14.0 0.65 0.60 1.00 0.15 1.45 0.40 0.20 22.1 20.1 16.1 14.1 -- 0.75 -- 0.10
L1
e b
D D1
A1
Y
A2
E1 E
0
--
7
Notes: 1. All dimensions are in millimeters (mm). 2. Package width and length do not include mold protrusion.
Rev: 2.13 11/2004
31/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
Package Dimensions--165-Bump FPBGA (Package D; Variation 1)
A1
TOP
BOTTOM O0.10M C O0.25M C A B O0.40~0.50
A1
1 2 3 4 5 6 7 8 9 10 A B C D E F G H J K L M N P R
11 10 9 8 7 6 5 4 3 2 A B C D E F G H J K L M N P R
1.0 10. 1.0
150.0
14.
A
0.450.05 0.25 C
1.0
1.0
0.15 C
B 0.20(4
130.0
(0.26
Rev: 2.13 11/2004
0.25~0.4 1.20
C
SEATING
32/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
Ordering Information for GSI Synchronous Burst RAMs Org
1M x 18 1M x 18 1M x 18 1M x 18 1M x 18 1M x 18 512K x 36 512K x 36 512K x 36 512K x 36 512K x 36 512K x 36 1M x 18 1M x 18 1M x 18 1M x 18 1M x 18 1M x 18 512K x 36 512K x 36 512K x 36 512K x 36 512K x 36 512K x 36 1M x 18 1M x 18 1M x 18 1M x 18 1M x 18
Part Number1
GS816118T-250 GS816118T-225 GS816118T-200 GS816118T-166 GS816118T-150 GS816118T-133 GS816136T-250 GS816136T-225 GS81613T-200 GS816136T-166 GS816136T-150 GS816136T-133 GS816118T-250I GS816118T-225I GS816118T-200I GS816118T-166I GS816118T-150I GS816118T-133I GS816136T-250I GS816136T-225I GS816136T-200I GS816136T-166I GS816136T-150I GS816136T-133I GS816118D-250 GS816118D-225 GS816118D-200 GS816118D-166 GS816118D-150
Type
Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through
Package
TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1)
Speed2 (MHz/ns)
250/5.5 225/6 200/6.5 166/7 150/7.5 133/8.5 250/5.5 225/6 200/6.5 166/7 150/7.5 133/8.5 250/5.5 225/6 200/6.5 166/7 150/7.5 133/8.5 250/5.5 225/6 200/6.5 166/7 150/7.5 133/8.5 250/5.5 225/6 200/6.5 166/7 150/7.5
TA3
C C C C C C C C C C C C I I I I I I I I I I I I C C C C C
Status
1M x 18 GS816118D-133 Pipeline/Flow Through 165 BGA (var. 1) 133/8.5 C Notes: 1. Customers requiring delivery in Tape and Reel should add the character "T" to the end of the part number. Example: GS816118T-166IT. 2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each device is Pipeline/Flow Through mode-selectable by the user. 3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range. 4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 2.13 11/2004
33/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
Ordering Information for GSI Synchronous Burst RAMs Org
512K x 32 512K x 32 512K x 32 512K x 32 512K x 32 512K x 32 512K x 36 512K x 36 512K x 36 512K x 36 512K x 36 512K x 36 1M x 18 1M x 18 1M x 18 1M x 18 1M x 18 1M x 18 512K x 32 512K x 32 512K x 32 512K x 32 512K x 32 512K x 32 512K x 36 512K x 36 512K x 36 512K x 36 512K x 36
Part Number1
GS816132D-250 GS816132D-225 GS816132D-200 GS816132D-166 GS816132D-150 GS816132D-133 GS816136D-250 GS816136D-225 GS816136D-200 GS816136D-166 GS816136D-150 GS816136D-133 GS816118D-250I GS816118D-225I GS816118D-200I GS816118D-166I GS816118D-150I GS816118D-133I GS816132D-250I GS816132D-225I GS816132D-200I GS816132D-166I GS816132D-150I GS816132D-133I GS816136D-250I GS816136D-225I GS816136D-200I GS816136D-166I GS816136D-150I
Type
Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through
Package
165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1)
Speed2 (MHz/ns)
250/5.5 225/6 200/6.5 166/7 150/7.5 133/8.5 250/5.5 225/6 200/6.5 166/7 150/7.5 133/8.5 250/5.5 225/6 200/6.5 166/7 150/7.5 133/8.5 250/5.5 225/6 200/6.5 166/7 150/7.5 133/8.5 250/5.5 225/6 200/6.5 166/7 150/7.5
TA3
C C C C C C C C C C C C I I I I I I I I I I I I I I I I I
Status
512K x 36 GS816136D-133I Pipeline/Flow Through 165 BGA (var. 1) 133/8.5 I Notes: 1. Customers requiring delivery in Tape and Reel should add the character "T" to the end of the part number. Example: GS816118T-166IT. 2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each device is Pipeline/Flow Through mode-selectable by the user. 3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range. 4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 2.13 11/2004
34/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
18Mb Sync SRAM Datasheet Revision History
DS/DateRev. Code: Old; New GS816118T-150IT 1.00 9/ 1999A;GS816118T-150IT 2.00 1/1999B GS816118T 2.01 1/ 2000C;GS816118 T 2.02 1/ 2000D Types of Changes Format or Content Content Page;Revisions;Reason * Converted from 0.25u 3.3V process to 0.18u 2.5V process. Master File Rev B * Added x72 Pinout. * Added GSI Logo. * Changed pin description in TQFP to match order of pins in pinout. * Front page; Features - changed 2.5V I/O supply to 2.5V or3.3V I/O supply; Core and Interface voltages - Changed paragraph to include information for 3.3V;Completeness * Absolute Maximum Ratings; Changed VDDQ - Value: From: .05 to VDD : to : -.05 to 3.6; Completeness. * Recommended Operating Conditions;Changed: I/O Supply Voltage- Max. from VDD to 3.6; Input High Voltage- Max. from VDD +0.3 to 3.6; Same page - took out Note 1;Completeness * Electrical Characteristics - Added second Output High Voltage line to table; completeness. * Note: There was not a Rev 2.02 for the 8160Z or the 8161Z. Content * Changed the value of ZZ recovery in the AC Electrical Characteristics table on page 15 from 20 ns to 100 ns * Added 225 MHz speed bin * Updated Pg. 1 table, AC Characteristics table, and Operating Currents table to match 815xxx * Updated format to comply with Technical Publications standards * Updated Capitance table--removed Input row and changed Output row to I/O * Updated Features list on page 1 * Completely reworked table on page 1 * Updated Mode Pin Functions table on page 7 * Added 3.3 V references to entire document * Updated Operating Conditions table * Updated Boundary Scan Chain table * Updated JTAG section * Added Pin 56 to Pin Description table * Updated Operating Currents table and added note * Update table on page 1; added power numbers * Updated Application Tips paragraph * Updated Synchronous Truth Table * Updated Operating Currents table * Updated table on page 1; updated power numbers * Updated Recommended Operating Conditions table (added VDDQ references)
GS18/362.0 1/2000DGS18/ 362.03 2/2000E
GS18/362.03 2/200E; 816118_r2_04 816118_r2_04; 816118_r2_05 816118_2_05; 816118_r2_06 816118_r2_06; 811618_r2_07
Content/Format
Content Content
816118_r2_07; 811618_r2_08
Content
816118_r2_08; 811618_r2_09
Content
Rev: 2.13 11/2004
35/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS816118(T/D)/GS816132(D)/GS816136(T/D)
18Mb Sync SRAM Datasheet Revision History
DS/DateRev. Code: Old; New Types of Changes Format or Content Page;Revisions;Reason * Updated table on page 1 * Created recommended operating conditions tables on pages 11 and 12 * Updated AC Electrical Characteristics table * Added Sleep mode description on page 22 * Updated Ordering Information for 225 MHz part (changed from 7ns to 6.5 ns) * Updated BSR table (2 and 3 changed to X (value undefined)) * Added 250 MHz speed bin * Deleted 180 MHz speed bin * Updated AC Characteristics table * Updated FT power numbers * Updated Mb references from 16Mb to 18Mb * Removed ByteSafe references * Changed DP and QE pins to NC * Updated ZZ recovery time diagram * Updated AC Test Conditions table and removed Output Load 2 diagram * Removed Preliminary banner * Removed pin locations from pin description table * Removed BSR table * Updated format * Updated timing diagrams * Added 165 BGA
816118_r2_09; 816118_r2_10
Content
816118_r2_10; 816118_r2_11
Content
816118_r2_11; 816118_r2_12 816118_r2_12; 816118_r2_13
Content
Format/Content
Rev: 2.13 11/2004
36/36
(c) 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

▲Up To Search▲

Price & Availability of GS816136T

	To Download GS816136T Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .